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Article | New technologies | New industrial production processes
Structural Electronics Platform
The Structural Electronics Platform is home to a wide range of resources for the integration of electronics directly onto flat and 3D surfaces. Electronics can be integrated onto rigid, flexible, and stretchable substrates measuring up to 320 x 380 mm² using either printing or vacuum deposition. Thermoforming is used to obtain 3D substrates. The platform also has pick and place (PNP) machines to assemble components. For plastronics-type projects, these processes can be used with plastic injection overmolding. The platform, unlike any other facility in Europe, is home to a wide range of process equipment and activities, helping drive innovation in human-machine interfaces, medical devices, interactive displays, and more.
IoT sensor manufacturers no longer have to choose between environmental performance and profitability thanks to a technology known as organic printed electronics. A label with an integrated impact detector for the tracking of fragile packages and other items was recently printed on a paper substrate. The self-powered sensor is sensitive enough to detect even the tiniest impacts.
The first-ever proof-of-concept prototypes that enable the creation of printed subsystems were recently completed using a second-generation transistor technology. This advance will pave the way toward the development of demonstrators with optimized electronic integration for specific applications.
€11 million in investment
1 100 sq. m of clean rooms
Transportation and Mobility
Human Health and Environment
Construction and Electrical Engineering
Internet of Things
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CEA is a French government-funded technological research organisation in four main areas: low-carbon energies, defense and security, information technologies and health technologies. A prominent player in the European Research Area, it is involved in setting up collaborative projects with many partners around the world.