Article | New technologies | New industrial production processes
Structural Electronics Platform
The Structural Electronics Platform is home to a wide range of resources for the integration of electronics directly onto flat and 3D surfaces. Electronics can be integrated onto rigid, flexible, and stretchable substrates measuring up to 320 x 380 mm² using either printing or vacuum deposition. Thermoforming is used to obtain 3D substrates. The platform also has pick and place (PNP) machines to assemble components. For plastronics-type projects, these processes can be used with plastic injection overmolding. The platform, unlike any other facility in Europe, is home to a wide range of process equipment and activities, helping drive innovation in human-machine interfaces, medical devices, interactive displays, and more.
Liten, a CEA Tech institute, leveraged its broad, deep knowledge of printed electronics and plastronics to develop a completely smooth car dashboard demonstrator with no mechanical buttons. The demonstrator was unveiled at the 2017 Geneva Auto Show.
Joint R&D conducted by CEA Tech institute Liten, chemical-industry leader Arkema, and Arkema subsidiary Piezotech won an Innovation Award at TechConnect World 2016. The award recognized the partners’ growing knowledge of printed electronics.
€11 million in investment
1 100 sq. m of clean rooms
Transportation and Mobility
Human Health and Environment
Construction and Electrical Engineering
Internet of Things
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CEA is a French government-funded technological research organisation in four main areas: low-carbon energies, defense and security, information technologies and health technologies. A prominent player in the European Research Area, it is involved in setting up collaborative projects with many partners around the world.