Structural Electronics Platform

Smart surfaces

The Structural Electronics Platform is home to a wide range of resources for the integration of electronics directly onto flat and 3D surfaces.  Electronics can be integrated onto rigid, flexible, and stretchable substrates measuring up to 320 x 380 mm² using either printing or vacuum deposition. Thermoforming is used to obtain 3D substrates. The platform also has pick and place (PNP) machines to assemble components.  For plastronics-type projects, these processes can be used with plastic injection overmolding. The platform, unlike any other facility in Europe, is home to a wide range of process equipment and activities, helping drive innovation in human-machine interfaces, medical devices, interactive displays, and more. 

• All sheet-to-sheet printing processes, whether manually or automatically fed, are conveniently located together. These include screen printing, inkjet printing, rotogravure, flexography, and slot-die printing.  The platform also has the necessary assembly and encapsulation machines.
  

• A full range of electrical, optical, and mechanical characterization tools for sensors and actuators
• Tools to test the reliability of components like sensors and actuators
• Tools to develop control electronics for sensors and actuators
• The possibility of making PoC and other prototypes, and manufacturing pilot prototypes